PCB & IME Expo 2027

2027杭州国际PCB及智能制造设备展览会

同期举办：第二届杭州国际半导体与集成电路创新展览会

展览时间：2027年5月27日-29日

展览地点：杭州大会展中心-浙江

Exhibition Date: May 27–29, 2027Exhibition Venue: Hangzhou Grand Convention and Exhibition Center, Zhejiang

主办与合作战略单位：

高登会展集团

浙江省人工智能学会

浙江省半导体行业协会

浙江省机器人产业发展协会

浙江省计算机信息系统集成行业协会

Organizers & Strategic Partners：Golden Conference & Exhibition Group

Zhejiang Artificial Intelligence Society

Zhejiang Semiconductor Industry Association

Zhejiang Robot Industry Association

Zhejiang Computer Information System Integration Industry Association

承办单位

杭州红杉会展有限公司

杭州智源展览有限公司

杭州长芯国际会展管理有限公司

Co-organizers：

Hangzhou Sequoia Exhibition Co., Ltd.

Hangzhou Wisdom Source Exhibition Co., Ltd.

Hangzhou SICE International Exhibition Management Co., Ltd.

主题：芯板协同，智造未来--打通芯片到硬件制造的最后一公里

Theme

Chip–PCB Synergy · Shaping the Future of Intelligent Manufacturing

Bridging the Final Mile from Chips to Hardware Manufacturing

展会概况Exhibition Overview

印制电路板被誉为“电子产品之母”，是芯片实现电气互联的核心载体。当AI算力奔涌而来，当新能源汽车疾驰向前，当第三代半导体重塑产业边界，国内高阶IC载板、高频高速板、高多层板需求持续走高，国产替代进程加速推进。“十五五”规划明确提出加快发展新一代智能制造，促进制造业“智改数转网联”，推动“人工智能+制造”加出新速度、新成效。在集成电路领域，规划纲要提出全链条推动关键核心技术攻关取得决定性突破。PCB产业作为电子信息制造业的基础环节，正迎来高端化、数智化、绿色化转型的政策窗口期。杭州及长三角地区为展会提供了坚实的产业腹地。杭州钱塘芯谷已集聚集成电路企业超140家，产业规模突破800亿元，晶圆制造能力占浙江省四分之一以上，是国内唯一同时具备4英寸至12英寸晶圆制造能力的区县。杭州市“智造社区”建设行动计划明确提出优化服务新一代半导体和集成电路、具身智能机器人等重点产业链核心制造环节。长三角地区集聚大量PCB成品厂、材料与装备企业，下游半导体、算力、新能源产业配套完善，具备得天独厚的产业区位优势。

Printed circuit boards (PCBs), often referred to as the “motherboards of electronic products,” are the core platform for electrical interconnection between chips and electronic systems. As AI computing power accelerates, new energy vehicles advance rapidly, and third-generation semiconductors reshape industry boundaries, demand for advanced IC substrates, high-frequency/high-speed PCBs, and high-layer-count boards continues to rise, accelerating the shift toward domestic alternatives.

China’s 15th Five-Year Plan calls for faster development of next-generation intelligent manufacturing, advancing the digital transformation, intelligent upgrading and networked integration of manufacturing, and driving new momentum through “AI + Manufacturing.” In the integrated circuit sector, the Plan also calls for breakthroughs in critical and core technologies across the entire value chain. As a foundational segment of electronic information manufacturing, the PCB industry is entering a strategic window for high-end, digital-intelligent and green transformation.

Hangzhou and the Yangtze River Delta provide a strong industrial base for the Expo. Hangzhou’s Qiantang Chip Valley is home to more than 140 integrated circuit companies, with the industry exceeding RMB 80 billion in scale. Its wafer manufacturing capacity accounts for more than one-quarter of Zhejiang Province’s total, making it the only county-level administrative area in China with wafer manufacturing capabilities spanning 4-inch to 12-inch wafers.

Hangzhou’s “Intelligent Manufacturing Community” Development Action Plan calls for enhanced support for core manufacturing segments across key industrial value chains, including next-generation semiconductors and integrated circuits and embodied intelligent robotics.

The Yangtze River Delta is home to a large concentration of PCB manufacturers, materials and equipment suppliers, supported by well-developed downstream ecosystems in semiconductors, AI computing and new energy. This integrated industrial landscape gives the region a distinctive location advantage and provides a strong foundation for the development of the PCB and intelligent manufacturing industries.

新的机遇New Opportunities

AI算力正把PCB需求快速推向高多层、高频、高速方向，行业增长逻辑正由规模扩张转向技术提升。在这一产业变革的关键节点，高登会展联合相关行业主管机构定于2027年5月27日至29日在杭州大会展中心召开 “2027杭州国际PCB及智能制造设备展览会”，并与第二届杭州国际半导体与集成电路产业创新展览会（杭州长芯展）同期同馆举办。本展会定位为长芯展核心配套子展，聚焦PCB全产业链及智能制造设备，补齐“芯片—基板—硬件制造”关键一环。与长芯展主展半导体全产业链深度协同：长芯主展汇聚IC设计、晶圆制造、先进封装、Chiplet、第三代半导体、AI芯片企业，大量芯片企业亟待寻找可靠的IC载板、高频高速PCB供应链；PCB展区实现上游芯片企业与PCB/载板、智能制造装备企业面对面对接，打通从芯片设计到硬件制造的完整链路。展会重点展示钻孔、曝光、电镀、蚀刻、成型、检测、自动化产线、MES、工业互联网、AI质检等智能制造设备与方案，助力PCB企业降本增效、提升良率、加快数字化转型。旨在补齐“芯片设计—晶圆制造—先进封装—IC载板/PCB—终端硬件”全产业链展示链路中的关键一环，搭建PCB与半导体产业精准对接平台，推动高端IC载板与智能制造装备的国产化突破，为长三角乃至全国电子电路产业的高质量发展注入新动能。

AI computing is rapidly driving PCB demand toward higher layer counts, higher frequencies and higher speeds, shifting the industry’s growth model from scale expansion to technology advancement.

At this critical sta of industrial transformation, Golden Conference & Exhibition Group, together with relevant industry authorities and organizations, will host the 2027 Hangzhou International PCB & Intelligent Manufacturing Equipment Expo from May 27–29, 2027, at the Hangzhou Grand Convention & Exhibition Center. The Expo will be held concurrently and in the same venue as The 2nd Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition (SICE).

Pitioned as a core supporting event of the SICE, the PCB Expo will focus on the entire PCB value chain and intelligent manufacturing equipment, addressing a critical link between chips, substrates and hardware manufacturing.

The Expo will work in close synergy with the Changxin Expo’s semiconductor value chain. The main expo will bring together companies across IC design, wafer manufacturing, advanced packaging, Chiplet, third-generation semiconductors and AI chips, many of which are seeking reliable supply chains for IC substrates and high-frequency/high-speed PCBs.

The PCB Expo will facilitate face-to-face business matchmaking between upstream chip companies and PCB/IC substrate manufacturers and intelligent manufacturing equipment suppliers, connecting the full chain from chip design to hardware manufacturing.

Key exhibits will include intelligent manufacturing equipment and solutions for drilling, expure, electroplating, etching, forming, inspection and testing, automated production lines, MES, industrial internet and AI-powered quality inspection, helping PCB manufacturers reduce costs, improve efficiency and yield, and accelerate digital transformation.

The Expo aims to complete the critical link in the exhibition chain spanning chip design → wafer manufacturing → advanced packaging → IC substrates/PCBs → end-product hardware, while creating a targeted matchmaking platform connecting the PCB and semiconductor industries. It will support advances in the domestic development of high-end IC substrates and intelligent manufacturing equipment, injecting new momentum into the high-quality development of the electronic circuit industry across the Yangtze River Delta and China.

同期活动Concurrent Events

展会同期将举办PCB智能制造与IC载板产业高峰论坛、IC载板技术与国产化替代研讨会、PCB智能制造与数字化转型论坛、PCB绿色制造与可持续发展论坛等多场高规格专业活动，汇聚行业、技术专家与产业，共话前沿趋势。同时设置PCB/载板专场供需对接会，定向邀请半导体企业、下游终端制造商、科研院所与机构面对面洽谈，推动技术交流与商务合作精准落地，让参展参会更具实效。

The Expo will feature a series of high-level professional events, including the PCB Intelligent Manufacturing & IC Substrate Industry Summit, IC Substrate Technology & Domestic Development Seminar, PCB Intelligent Manufacturing & Digital Transformation Forum, and PCB Green Manufacturing & Sustainable Development Forum. Industry leaders, technology experts and investors will come together to explore emerging trends and opportunities across the sector.

A dedicated PCB/IC Substrate Supply-Demand Matchmaking Session will also be held, bringing together semiconductor companies, downstream manufacturers, research institutes and investment institutions for targeted, face-to-face discussions. The program is designed to facilitate focused technical exchange, accelerate business cooperation and deliver tangible outcomes for exhibitors and participants.

展区设置Exhibition Zones

1、电路板成品展示区：刚性PCB、柔性FPC、刚挠结合板、高频高速板、厚铜板、特种电路板、IC载板（BT/ABF）等；

2、PCB关键原辅材料区：覆铜板、半固化片、铜箔、油墨、干膜、防焊漆、电镀化学品、特种树脂等；

3、智能制造工艺设备区：钻孔、电镀、压合、蚀刻、曝光、成型、激光加工等设备；

4、检测与测试设备区：AOI、AXI、阻抗测试、飞针测试、在线检测系统等；

5、自动化产线与数字化方案区：自动化生产线、AGV物流、MES、工业互联网、AI质量管控、环保处理方案等

6、供需对接与产业服务区：封闭洽谈、产业招商、人才对接。

1. Finished PCB Products

Rigid PCBs, flexible PCBs (FPCs), rigid-flex PCBs, high-frequency/high-speed PCBs, heavy-copper PCBs, specialty PCBs, IC substrates (BT/ABF), and more.

2. Key PCB Materials & Chemicals

Copper-clad laminates (CCLs), prepregs, copper foil, inks, dry films, solder masks, plating chemicals, specialty resins, and other key materials and chemicals.

3. Intelligent Manufacturing Process Equipment

Drilling, electroplating, lamination, etching, expure, forming, laser processing and other PCB manufacturing equipment.

4. Inspection & Testing Equipment

Automated optical inspection (AOI), automated X-ray inspection (AXI), impedance testing, flying probe testing, in-line inspection systems and other testing and inspection solutions.

5. Automated Production Lines & Digital Solutions

Automated production lines, AGV logistics systems, manufacturing execution systems (MES), industrial internet platforms, AI-powered quality control, environmental protection and waste treatment solutions, and more.

6. Business Matchmaking & Industry Services

Closed-door business meetings, investment attraction, talent matchmaking, investment and financing matchmaking, and related industry services.

目标观众Target Visitors

组委会精准邀约全球电子信息产业核心力量：涵盖IC设计、先进封装、Chiplet、第三代半导体、功率器件、AI/存储芯片等半导体采购研发人员；PCB/FPC/IC载板、覆铜板及材料厂商设备采购、工艺研发与质量部门；AI服务器、算力硬件、新能源汽车电子、通信、工控、消费电子终端制造商；汽车电子、航空航天、海洋电子方案商；以及软件生态、科研院所、高校、园区、机构、产业基金、政府主管部门及行业组织。

联系方式Contact Information

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